Is a world wide authorized distributor of packages and lids for ic assembly.
Ceramic semiconductor packages.
The first semiconductor package.
Three engineers from fairchild.
Micro ball grid array μbga.
Hermetic packages national semiconductor offers a wide variety of ceramic and metal can packages for through hole and surface mount ap plications.
These ceramic and metal can packages are of.
For 30 years our proven track record consistent customer service and long standing supplier relationships makes us the premier distributor for your ic packaging needs.
A package with metric pin distribution 0 5 mm pitch.
However the simple construc.
The pressed ceramic packages are typically lower in cost than the multilayer packages.
These packages protect the crystal with full hermetic sealing for high reliability while measuring just 1 0 x 0 8 mm among the world s smallest.
This was the first real semiconductor package.
Ultra small ceramic packages help miniaturize highly functional crystal devices which are essential in electronics.
Located in silicon valley spectrum semiconductor materials inc.
Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition.
High pin count semiconductor packaging.
The body of the component is ceramic.
Depending on the application weight thermal solution and material requirements ametek can help you design a package using one of these technologies to best meet your requirements.
Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition.
A circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
Cerpac packages sold in three separate components cerpac base cerpac frame and cerpac cap.
Dip packages came into volume production in early 70 s.
Miniature ceramic packages for crystal devices.
Ceramic column grid array ccga.
Don forbes rex rice and bryant rogers invented a 14 lead ceramic dual in line package dip with two rows of pins.
Spectrum semiconductor materials extensive inventory of ceramic cerpac packages are available in 14 18 20 24 and 28 pin configurations.
Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016.